RELIABILITY: CONCEPTS and TRENDS
by Carlos Perez
While the word reliability is frequently used, unfortunately, the way it is used ignores its true context and real implication. With the various improvement techniques in asset improvement, the use of the reliability word has created a constant advertising siege.
The most known concept to define reliability is: “Probability that an asset or system operates without failing during a given period of time under some operation conditions previously established.”
Sometimes, this concept is wrongly used due to the particular use given to the word failure.
For many, failure only means shutdowns, so they construct complex mathematical formulas to calculate shutdown probability without taking into account that a failure also occurs when being inefficient, insecure and costly, having a high rejection level, or contributing to a bad image.
Other factors to be taken into account are shutdown causes that may occur for numerous reasons, so comparing apples and oranges, as the expression goes, should be avoided. An example is comparing shutdowns due to bearing lubrication with shutdowns due to errors in bearing mountings. It is not the same changing an item because it is going to fail versus changing it because it failed versus changing it because a frequency was met before it failed.
Specifying an item that failed due to wearing is not the same as another that failed due to an improper installation or one damaged by an accident.
Is It a Statistic Issue?
A common discussion is whether or not reliability is a statistic issue. Managing data has an undeniable usefulness in the company’s management and direction. It is necessary to distinguish if statistics are used to manage real data to see its behavior or to support forecasts and estimations that sometimes border on daring and irresponsible speculations.
Some authors adhere to defining mathematical postulates as an absolute truth about failures and deny the fact that numbers of analyzed failures mix effects with causes. In addition, they deny that having failure data to analyze is accepting that failures occur and with more data come more failures.
The most common misconception of reliability is that it is like the average time between failure occurrences. This statement has several connotations to consider. The first is to remember that the cipher is an average and the failure concept is associated with more shutdowns than with unconformities, such as spilling, a nonconforming product, or increased risks, which are failures too.
Datum as such, is an average cipher. There’s a big difference between probability and reality, thus generating confusion. A probable failure is a possible failure and an occurred failure is a real failure, but a calculus logarithm doesn’t necessarily assure its occurrence at a given point.
Therefore, using calculated, desired, estimated, arbitrarily fixed, imagined, recommended by manuals and even invented ciphers may carry error percentages, inaccuracies and deficiencies requiring responsible handling.
Getting back to boiler failures:
Assume that 10 failure modes are produced within 720 hours (one month).
Only two of the failure causes listed in Figure 2 produce a shutdown, generating a total of 20 shutdown hours.
According to the traditional failure concept, the calculation of MTBF for the boiler would be: MTBF =
(720 hours - 20 hours) / 2 failures = 350 hours.
If the company’s MTBF goal is 300 hours, the goal would be met.
The probability that the boiler does not fail before the MTBF goal would be calculated this way:
e-(300/350) = 42.5 percent.
Thus, analyzing numbers may only give peace of mind to some people since there are other reasons an asset may fail, such as:
Non-compliance of cleaning standards;
Inoperative protections;
Harmful situations for security and the environment;
Greater fuel consumption, which is a greater cost.If the asset does not perform all required functions as desired, it is also considered a failure.
Therefore, if the real failure concept is applied, calculations would be different:
MTBF = 720 hours - 20 hours / 10 failures = 70 hours.
Since the company’s MTBF is 300 hours, the purpose would not be met.
With the current failure concept, the probability that the boiler does not fail before the MTBF goal
would be calculated this way: Probability = e-(70/350) = 1.37 percent.Very few companies have
data on MTBF; what they really have is datum on mean time between shutdowns.
Very few companies record failure occurrence using the failure mode scope and those that do,
their information systems make the MTBF calculation difficult.
So, what’s the solution? The time being used for mathematical calculation of MTBF or failure probability would be better spent defining failure consequences and devising an action plan to mitigate those consequences.
How to Improve Reliability
Currently, the issue facing maintenance staff is not only learning what the new techniques are, but also being able to decide which ones are useful for their companies.
If properly chosen and used in an integrated manner, maintenance practices and outputs will likely improve. Likewise, costs will be optimized. If improperly chosen, more problems will be created which, in turn, will worsen existing ones.
Some companies have gone beyond statistics and have reviewed their internal practices, carrying out benchmarking with those that are outstanding. These organizations came to the conclusion that it is impossible to talk about reliability as a unique cipher. Therefore, it is necessary to use several measurements as fundamental indicators of inputs/outputs of the processes.
The need for reliability in installations is as old as humanity, but undeniably, the growing relevance of environmental issues and their security have led to the need of changing orientation of some markets and niches due to:
More complex products.
Greater pressure to reduce costs to be more competitive.
A greater number of operational functions carried out by equipment and machines.
Requirements to reduce products’ weight and volume, and maintaining and improving performance and security standards.
Requirements to increase or reduce operation duration of products to increase or reduce demand.
Greater difficulties to carry out maintenance interventions due to asset utilization increases.
Trends to use software, electronic, pneumatic, or hydraulic components having different wearing behavior in response to components failing in function of age.
Current legislation that is increasingly more demanding and less tolerant.
Greater impact of shutdowns and operational losses on sales and products.
Growing demands for quality in services and products.
New perceptions of a company’s image or commitment.
Commitments to reduce the human life loss risk.
Requests to reduce the spilling risk or affectations of the equipment on the environment.
These new demands drive the use of strategies that have been successfully applied in many companies, strengthening global performance, optimizing costs, reducing risks, improving corporate image, lowering environmental impact and consolidating business results.
Successful companies have made a concerted effort to incorporate their maintenance improvement strategies into other corporate initiatives, avoiding or preventing the syndrome of the campaign of the moment, peak of the wave, or the promotion of the month. The best indication that this effort produces satisfaction is when it turns into a durable and stable policy.
Among the most successful tools being used consistently are:
Reliability as a global concept instead of reducing costs or downtime.
Carrying out diagnoses, audits and evaluations of maintenance practices.
A development strategic plan describing and establishing a corporate vision related to reliability and asset good performance.
Extensive utilization of performance measurements with appropriate goals.
Benchmarking to identify opportunities and barriers for improvement.
Sharing knowledge and achieving consensus among areas typically separated; using teams with different functions and specialties who work together during a specific period of time to analyze problems and opportunities aimed at a common output.
Conclusion
To achieve reliability, maintenance is not the only responsible area. It requires responsible designs, consistent and trained operators, professional purchasers and stable policies. In other words, several responsible actors take part during an asset’s lifecycle.
Maintenance is considered an action; it is more of a joint responsibility than a function.
Maintenance starts with selecting equipment and follows with installation. It is supported by the right operation and good maintenance, with support provided by purchases and inventories.
Those responsible for whether assets will be reliable or not are: design; selection; manufacturing; suppliers; installation; environment; operation; maintenance; stores; and purchases.
As you can see, improving MTBF is not enough.
Carlos Mario Perez Jaramillo is a Mechanical Engineer and Information
Systems Specialist for Soporte y Cía. Mr. Perez is a specialist in asset
management and project management and has worked in
dissemination, training and application of RCM2.
www.soporteycia.com
©2015 Reliabilityweb.com
Interesting articles about the electronic production and testing lab. Very usefull in the last 6 years at a Reliability Lab.
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quinta-feira, 19 de janeiro de 2017
IPC - Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance
Feed: IPC Blog
Posted on: sexta-feira, 20 de novembro de 2015 12:58
Author: IPC
Subject: IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance
Posted on: sexta-feira, 20 de novembro de 2015 12:58
Author: IPC
Subject: IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance
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IPC Standards Committee Reports These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in the series of reports Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group met to review the newly developed Users Guide for the IPC-2221B Gerber Coupon Generator that will be released for use by the industry in late 2015. The Generator allows for the creation of Gerber files for test coupon designs found in Appendix A of IPC-2221B, Generic Standard on Printed Board Design. The group also reviewed a demo for a modification to the Gerber Coupon Generator for a propagated “D” coupon. Cleaning and Coating The 5-31g Stencil Cleaning Task Group met to work on IPC-7526, Stencil and Misprinted Board Cleaning Handbook. Sections 1 and 2 were revised. Material compatibility, snapback, dry vs wet wipe, nano-coating stencils, and small openings were among the subjects discussed. The 5-31j Cleaning Compatibility Task Group met to discuss how to begin verification testing. They want to create acceptability levels for OEM and CM companies. Confirmation testing and test materials were discussed. Comments on document to be reviewed after the end of the year The 5-32a Ionic Conductivity Task Group discussed the status of several ongoing projects involving Ion Chromatography. This includes: method detection limit round robin testing, IC Webinar for the SMART group from Doug Pauls, Rockwell Collins, updating WP-008, extract correlation study, localized extraction, and the J-STD-001 ROSE effort. The 5-32b SIR and Electrochemical Migration Task Group met to discuss the statuses of several ongoing projects regarding SIR testing including: Round Robin study for hard wire vs test rack testing, discussion of several test methods, High Voltage SIR testing, and review of IPC-9203, B-52 Test Coupon User’s Guide. The 5-32c Bare Board Cleanliness Assessment Task Group met to finalize the decisions made regarding five Test methods. A study was initiated to support the update of IPC-5704, Cleanliness Requirements for Unpopulated Boards in hopes of adding it as a requirement in IPC-6012, Performance of Rigid Printed Boards. The 5-32e Conductive Anodic Filament (CAF) Task Group continued the revision of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) The 5-33a Conformal Coating Task Group met to work on Revision C of IPC-CC-830, Qualification and Performance of Electrical Insulating Compounds for Printed Wiring Assemblies. DWV/MIR white paper was presented and decisions were made regarding what to include in CC-830C. The new Test Coupon, B-54, was presented. 5-33AWG also met to work on the CC-830 Handbook. Plexus presented pictures for use by the committee and Electrolube UK showed presentation on coating performance. The 5-33g Low Pressure Molding Task Group continues to address the Draft of IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics. Testing The 7-11 Test Methods Subcommittee to review a proposal by Gerard O’Brien, StandS Group, for using XRF to determine phosphorous content in ENIG. There was a discussion of a Validation Process and Method Review for IPC methods. They proposed that the TAEC review all released Test Methods, new and revised. Also proposed that IPC could potentially provide validation for Test Method operators and auditing to ensure proper testing. The 7-12 Microsection Subcommittee met to continue the revision of IPC-9241, Microsectioning Guideline (formerly MS-810) and review the comments on KAVI. Feedback from the recently released TM 2.1.1F, Microsectioning, Manual Method and a proposed Microsectioning Training course were also discussed. The D-32 Thermal Stress Test Methods Subcommittee met to discuss the next steps moving forward on the revision of TM 2.6.7.2, Thermal Shock and 2.6.27, Thermal Stress. A PIN is to be drafted and discussed at the next teleconference. Process Control The 7-23 Assembly Process Effects Handbook Subcommittee met to discuss the format and content of the new IPC-9111, Troubleshooting for Printed Board Assembly Processes, before going to Final Industry Review. Product Assurance The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held in APEX 2016. The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610, Acceptability for Electronic Assemblies. The Task Group met a second day to resolve comments on criteria comment to both IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The group also celebrated completion of the forthcoming IPC-A-610 Revision F Amendment 1. The 7-31bc Telecom Addendum Task Group met to continue discussions on the revision of the document. The Task Group plans to update the addendum using Revision F of IPC-A-610, Acceptability for Electronic Assemblies as the base document. The 7-31f Task Group responsible for IPC-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, met to continue revision work on the document. The 7-31j Task Group met to continue revising IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures. The Task Group also discussed and approved a new title for the standard that will be introduced with the revision. The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group met to celebrate the forthcoming IPC-D-620, Design and Critical Process Requirements for Cable and Wiring Harnesses, and to open discussion on IPC-HDBK-620, Handbook and Guide to Supplement IPC-A-620. The 7-31m Fiber Optic Cable Acceptability Task Group agreed to split the working draft IPC-A-640 into separate standards for design (IPC-D-640) and acceptance (IPC-A-640). Because most of the content for the design document is already on hand, the group will focus first on IPC-D-640, with plans to ballot by APEX/EXPO, and will pick up work on IPC-A-640 near that time, with a goal to publish later in 2016. The 7-32c Electrical Continuity Task Group met to review industry responses to a survey on adjacency testing for bare printed board electrical test. Additional input on the need to specify a minimum retention period for electrical test data and clarification on when electrical testing for Class 3 product can be agreed upon between user and supplier drove the group to determine that a “B” revision to the IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards, should be developed for a 2016 release. The 7-34 Repairability Subcommittee met to continue revising IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies. Filed under: Boards, Committees, IPC, Materials, Standards, Technical Tagged: cleaning and coating, IPC standards committee reports, printed board design, process control, product assurance, testing |
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Potential Processes for Automation
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IPC - Product Compliance Requires Supply Chain Transparency
Feed: IPC Blog
Posted on: quarta-feira, 9 de março de 2016 11:29
Author: IPC
Subject: Product Compliance Requires Supply Chain Transparency
Posted on: quarta-feira, 9 de março de 2016 11:29
Author: IPC
Subject: Product Compliance Requires Supply Chain Transparency
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By Tord Dennis, WSP USA Changes to the RoHS, REACH, and conflict minerals regulations make the need for supply chain transparency more crucial than ever. The European Court of Justice (ECJ) ruled in 2015 that the 0.1% threshold for notifying SVHCs ( Substances of Very High Concern) in articles applies to “each of the articles incorporated as a component of a complex product” and not to the entire article. Companies that file with the SEC must annually determine and report the sources of tin, tungsten, tantalum, and gold (3TG) in their products under section 1502 of the U.S. Dodd-Frank Wall Street Reform and Consumer Protection Act. Suppliers cannot afford to claim “confidentiality” or ignorance to the material and substance make-up of the products they sell that become part of another company’s product. Leary of public backlash and/or legal action, some OEMs are taking drastic measures such as discontinuing business with suppliers who do not give them the information they need in a timely manner. Full material declaration (FMD) is quickly becoming the “gold standard” data requirement for an OEM to accurately assess the risk of restricted materials in a product. This means that suppliers must deliver the complete material and substance breakdown of their component/product in a manner that puts the least amount of impact on their core business activities and enables the OEM to collect and aggregate similar information from other suppliers. IPC has developed a family of standards dedicated to this task. The IPC-175x family of standards (e.g., IPC-1752A for material and substance declaration and IPC-1755 for conflict minerals) establishes a standard reporting format for data exchange between supply chain participants. It defines the information that most companies need to collect in order to prove compliance. It also specifies an XML-schema which enables more efficient and effective exchange of data by enterprise data systems. Automating the exchange of FMD data is made simpler with the adoption of the IPC-175x family of standards but other critical elements must be in place to achieve success. The OEM needs to build a product stewardship process that enables them to efficiently collect and analyze the FMD data from their supply chain. This means they must have executive level support and a well thought out implementation plan for enterprise software to manage this data. The OEM and the supplier must commit to being partners in this venture; “no data means no business” for all parties involved. A statement must be included in supplier contracts that require documentation pursuant to any government’s legal requirements regarding restricted materials and substances. To learn more, attend technical conference session, S03 at IPC APEX EXPO. I will present a paper titled, “Best Practices for Product Environmental Data Collection,” on Tuesday, March 15, 2016 at 2:00 pm. To learn more or register for IPC APEX EXPO, visit www.ipcapexexpo.org. |
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