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quarta-feira, 28 de agosto de 2013

Through Hole Technology

THT -  assembly with leaded components

When use is made of Through-HoleTechnology (THT), which was the standard process in module production up to a few years ago, the wire terminals of the components are inserted into the holes on the printed circuit board.
Boards are assembled manually or with special placement machines. The so-called manual or wave soldering
process is used.
Drawbacks of THT:
  •  production is time-consuming and costly
  • low function density
  • increased susceptibility to faults due to a lack of manual precision

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